| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the boron nitride content in a thermally conductive sheet with a small dielectric constant. <P>SOLUTION: A thermally conductive filler and a hollow filler mixed with a parent material with composition shown in the table are kneaded, formed into a sheet shape, and vulcanized. In each of successfully formed exemplars, the relative dielectric constant at 100 MHz was less than 4.0. In addition, the thermal conductivity was 0.8 W/(m K) or greater, and the Asker C hardness was 30 or less. <P>COPYRIGHT: (C)2012,JPO&INPIT |
