| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer frame cassette which can be produced at low costs using a simple facility. <P>SOLUTION: A wafer frame cassette 1 capable of housing inside of the cassette a plurality of frames 100, to which a semiconductor wafer is mounted, comprises: a pair of wall members 11, on which a plurality of shelf fastening holes 13 are formed at constant intervals, and which are provided in parallel to each other; a plurality of shelf members 15, which are fixed to the plural shelf fastening holes 13, and on which a loading surface 16a for loading a peripheral edge of one of the plural frames 100 is formed; and a frame body 2 connecting a pair of the wall members 11 to each other. <P>COPYRIGHT: (C)2012,JPO&INPIT |
