| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve reduction of chip cost and enhancement of the yield of chips simultaneously. <P>SOLUTION: The semiconductor chip is provided with a first layout L1 having a pad region 11 and a non-square gate region 12, and a second layout L2 obtained by rotating the first layout L1 by 180°. The first and second layouts L1, L2 configure a chip layout when they are combined point symmetrically without overlapping. The chip layout is arranged in a square chip region, and the first and second layouts L1, L2 configure LSIs operating independently. <P>COPYRIGHT: (C)2012,JPO&INPIT |
