发明名称 COMPOSITE METAL FOIL AND METHOD FOR PRODUCING THE SAME, AND PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a composite metal foil which can be easily released after a heating compression process even when an acidic plating bath is used and the residue of which hardly remains at a substrate side of a printed wiring board and to provide a method for producing the composite metal foil. <P>SOLUTION: The composite metal foil has, on a carrier 2 made of a metal foil, a diffusion preventing layer 3 for preventing diffusion of a metal to a metal atom constituting the carrier 2, a release layer 4 made of a metal layer formed by a physical film-deposition method and a transfer layer 5 formed by a plating method. The release layer 4 and the transfer layer 5 comprise the same kind of metal atoms. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012115989(A) 申请公布日期 2012.06.21
申请号 JP20100247574 申请日期 2010.11.04
申请人 FUKUDA METAL FOIL & POWDER CO LTD;OIKE IND CO LTD 发明人 OSHIRO YUKIHIRO;KAWAHARA HIDEKI;INAMORI TADAHIRO
分类号 B32B15/01;B32B15/08;H05K1/09 主分类号 B32B15/01
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