发明名称 |
COMPOSITE METAL FOIL AND METHOD FOR PRODUCING THE SAME, AND PRINTED WIRING BOARD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a composite metal foil which can be easily released after a heating compression process even when an acidic plating bath is used and the residue of which hardly remains at a substrate side of a printed wiring board and to provide a method for producing the composite metal foil. <P>SOLUTION: The composite metal foil has, on a carrier 2 made of a metal foil, a diffusion preventing layer 3 for preventing diffusion of a metal to a metal atom constituting the carrier 2, a release layer 4 made of a metal layer formed by a physical film-deposition method and a transfer layer 5 formed by a plating method. The release layer 4 and the transfer layer 5 comprise the same kind of metal atoms. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012115989(A) |
申请公布日期 |
2012.06.21 |
申请号 |
JP20100247574 |
申请日期 |
2010.11.04 |
申请人 |
FUKUDA METAL FOIL & POWDER CO LTD;OIKE IND CO LTD |
发明人 |
OSHIRO YUKIHIRO;KAWAHARA HIDEKI;INAMORI TADAHIRO |
分类号 |
B32B15/01;B32B15/08;H05K1/09 |
主分类号 |
B32B15/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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