ARTICLE HAVING CURABLE COATING COMPRISING IMIDAZOLIUM MONOCARBOXYLATE SALT

摘要

A coated substrate comprising a curable composition useful for preparing conformally sealed printed wiring boards is disclosed. The curable composition comprises an uncured epoxy composition comprising an uncured epoxy, a phenolic curing agent, and an imidazolium monocarboxylate salt. Method for preparation and curing are also provided. Of particular utility are compositions comprising 2-ethyl-4-methyl imidazolium monocarboxylate salts.