发明名称 |
HEAT-CURING RESIN COMPOSITION, HEAT-CURING ADHESIVE SHEET, AND METHOD FOR PRODUCING HEAT-CURING ADHESIVE SHEET |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-curing resin composition having favorable seepage properties for an unreacted epoxy resin and the like at the time of heat-pressure molding, without ultraviolet irradiation or the like. <P>SOLUTION: The heat-curing resin composition contains: an acrylic copolymer containing a (meth) acrylic acid ester monomer that contains an epoxy group; an epoxy resin, and a curing agent for the epoxy resin. The curing agent contains an organic acid dihydrazide. The epoxy group section of the acrylic copolymer is partially cross-linked via a liquid polyamine or a polyamideamine having at least one of either a primary amino group or a secondary amino group. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012116957(A) |
申请公布日期 |
2012.06.21 |
申请号 |
JP20100268081 |
申请日期 |
2010.12.01 |
申请人 |
SONY CHEMICAL & INFORMATION DEVICE CORP |
发明人 |
NATORI TOSHIKI |
分类号 |
C08L33/14;C08K5/17;C08K5/25;C08L63/00;C09J7/02;C09J11/06;C09J133/06;C09J163/00 |
主分类号 |
C08L33/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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