| 发明名称 |
METHOD AND DEVICE FOR MOLDING SEAMLESS BELT |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and device for molding a seamless belt that can prevent air bubbles from forming on the surface of the seamless belt. <P>SOLUTION: The method includes: forming a film 10 by adding tension to a mold belt 1 put around a plurality of rollers, and applying a seamless belt resin material to the mold belt 1 while the mold belt 1 is driven to run around; heating and solidifying the film 10 on the mold belt by heating the mold belt 1 while the mold belt 1 is driven to run around; and obtaining a molded seamless belt by peeling the solidified film from the mold belt 1 after the tension is removed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012116015(A) |
申请公布日期 |
2012.06.21 |
| 申请号 |
JP20100265693 |
申请日期 |
2010.11.29 |
| 申请人 |
RICOH CO LTD |
发明人 |
HOSOKAWA KENJI;MURAMATSU SUSUMU;MIYAKE KEIICHI;TATSUMI YASUAKI |
| 分类号 |
B29C41/02;B29C41/46;B29L29/00;G03G15/00;G03G15/16;G03G15/20;G03G21/00 |
主分类号 |
B29C41/02 |
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