| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent an adhesive layer from peeling from a solder resist layer. <P>SOLUTION: A semiconductor device includes: an insulation substrate; a conductor layer formed so as to have a predetermined pattern on the insulation substrate; a solder resist layer covering and protecting the conductor layer which needs covering protection, out of the conductor layer on the insulation substrate; an adhesive layer adhering and fixing a semiconductor chip on the solder resist layer; and the semiconductor chip adhered and fixed on the adhesive layer. The adhesive layer has a region adhered to the insulation substrate in a peripheral part of a formation area of the solder resist layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
