| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a high heat dissipation substrate exhibiting excellent thermal conductivity in the thickness direction. <P>SOLUTION: A high heat dissipation substrate 100 comprises a planar CFRP plate 1 composed of a carbon fiber-reinforced plastic material, and insulation layers 50a, 50b and circuit layers 51a, 51b formed, respectively, on each side of the CFRP plate 1 by laminating pre-pregs 2a, 2b, 4a, 4b and pre-pregs 5a, 5b, 6a, 6b containing glass cloth, and spreads heat generated from an electronic component 12 mounted on the surface of the circuit layer 51a to the whole substrate by means of the CFRP plate 1. The high heat dissipation substrate 100 has a columnar solid material 10, formed of a metal material, buried to reach the CFRP plate 1 by penetrating the pre-pregs 6a, 5a containing the glass cloth and the pre-pregs 4a, 2a, and fixed to the CFRP plate 1 via a thermally-conductive adhesive 11. <P>COPYRIGHT: (C)2012,JPO&INPIT |
