发明名称 |
SEMICONDUCTOR PACKAGE AND PACKAGE ON PACKAGE HAVING THE SAME |
摘要 |
A semiconductor package and a package on package are provided. The semiconductor package includes a substrate; a semiconductor chip attached to a surface of the substrate; connecting conductors disposed on the surface of the substrate; a mold formed on the substrate and in which the connecting conductors and the semiconductor chip are provided; and connecting via holes extending through the mold and exposing the connecting conductors. With respect to a first connecting via hole of the connecting via holes, a planar distance between a first connecting conductor exposed by the first connecting via hole and an entrance of the first connecting via hole is not uniform. |
申请公布号 |
US2012153499(A1) |
申请公布日期 |
2012.06.21 |
申请号 |
US201113244506 |
申请日期 |
2011.09.25 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
BYUN HAK-KYOON;CHOI DAE-YOUNG;KIM MI-YEON |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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