Module for reducing thermomechanical stress on e.g. surface wave filters, has encapsulated components provided on support substrate, and encapsulation mass surrounding components, where encapsulation mass comprises material recess

摘要

The module (100) has encapsulated components (20) provided on a support substrate (10), and an encapsulation mass (30) surrounding the components, where the encapsulation mass comprises a material recess (40). The material recess partially surrounds the components and is extended up to the support substrate in the encapsulation mass. The recess is formed as a gap (41) or hole or cavity. The recess consists of filling material e.g. polymer such as endowed polymer or polymer filled with hollow sphere-shaped elements. A lid is made of metal or plastic. An independent claim is also included for a method for manufacturing a module for reducing thermomechanical stress.