| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device. <P>SOLUTION: The method for manufacturing a semiconductor device comprises a step providing a semiconductor die having a die pad layout including a signal pad positioned mainly in a peripheral region of the semiconductor die, and a power pad and a ground pad positioned mainly in an inner region of the semiconductor die from the signal pad; a step for forming a plurality of bumps on the signal pad, the power pad and the ground pad; a step for providing a substrate; a step for forming a plurality of conductive traces including an interconnection part on the substrate where a width of the bump is wider than that of the interconnection part; a step for bonding the bumps to the interconnection part so as to cover a top and a side surfaces of the interconnection part by the bumps; and a step for depositing encapsulation members around the bumps between the semiconductor die and the substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
