| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device and the semiconductor device which improves heat radiation by using a metal mold that does not need presser pins. <P>SOLUTION: A manufacturing method of a semiconductor device 11 has: a process in which an assembly intermediate body, in which a power element 4 is placed on one surface of a metal plate 3 having a lead terminal 2 and an insulation resin layer 5 having a feature that thermal expansion is caused by heating is secured between the other surface of the metal plate and an upper surface of a metal layer, is prepared; a process in which the assembly intermediate body is placed so that a lower surface of the metal layer of the assembly intermediate body faces a bottom surface of a lower metal mold recessed part 24 in a resin sealing metal mold; a process in which a mold resin filling space 28 is formed with recessed parts of a lower metal mold 22 and an upper metal mold 21; a process in which the insulation resin layer is heated, the thickness of the insulation resin layer is increased, and the metal layer is pressed toward the bottom surface of the recessed part of the lower metal mold; and a process in which the mold resin filling space is filled with a mold resin. <P>COPYRIGHT: (C)2012,JPO&INPIT |
