| 摘要 |
There is provided a board connection structure capable of preventing occurrence of a connection failure, which would otherwise be caused by an uneven temperature increase in connection region of circuit boards during thermo-compression bonding. A board connection structure 10 includes a hard base material 21 having first and second surfaces; a printed circuit board 20 including a plurality of circuit patterns 23 provided on the second surface; a soft base material 31 having first and second surfaces; a flexible circuit board 30 including a plurality of circuit patterns 33 provided on the second surface; a connection sections (connection region) 24, 34 for connecting the circuit patterns 23 of the printed circuit board 20 to the circuit patterns 33 of the flexible circuit board 30 by way of a conductive connection material; and a heat conduction layer 50 that is provided on the first surface of the flexible circuit board 30 and that exhibits predetermined heat conductivity that is higher than heat conductivity of the hard base material 21 of the circuit board. The heat conduction layer 50 opposes some of the plurality of circuit patterns 33 of the flexible circuit board 30 by way of the soft base material 31 and is provided so as to stretch between a part of the connection region and a region adjacent to the connection region.
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