METHOD FOR FORMING TIN FILM, NONVOLATILE MEMORY DEVICE USING IT AND MANUFACTURING METHOD THEREOF
摘要
<p>PURPOSE: A method for forming a TiN thin film, a nonvolatile memory device, and a manufacturing method thereof are provided to easily control the thickness of a thin film by changing a cycle number of a Tin thin film forming process. CONSTITUTION: An insulation film pattern(120) including an opening unit(125) is formed on a substrate. A switching device is formed in the opening. A bottom electrode(147') comprising a TiN thin film is formed on the switching device. A variable resistive material pattern(150') is formed on the bottom electrode. A phase change material pattern(162) and a top electrode contact(164) are formed on the bottom electrode.</p>
申请公布号
KR20120065799(A)
申请公布日期
2012.06.21
申请号
KR20100127107
申请日期
2010.12.13
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
PARK, YOUNG LIM;LEE, JIN IL;CHUNG, KYUNG MIN;JUNG, SUG WOO;KIM, CHANG SU