SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To reduce defects of a semiconductor substrate; manufacture a semiconductor substrate at a higher yield with less defects; and manufacture a semiconductor device at a higher yield.

SOLUTION: The semiconductor substrate manufacturing method includes providing a semiconductor layer on a support substrate via an oxide insulation layer, removing an insulation layer on a surface of the semiconductor layer after enhancing adhesion of the support substrate and the oxide insulation layer at an edge portion of the semiconductor layer, and irradiating the semiconductor layer with laser beams to obtain the planarized semiconductor layer. In order to enhance adhesion of the support substrate and the oxide insulation layer at the edge portion of the semiconductor layer, the surface of the semiconductor layer is irradiated with laser beams.

COPYRIGHT: (C)2012,JPO&INPIT