| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive film in which when carrying out flip chip packaging of a semiconductor chip at a wiring board, a filler and a resin composition of non-conductivity are fully eliminated from between a connection pad of a wiring board or a bump, and a bump of a semiconductor chip, and thereby which can assure reliable conduction, and to provide a wiring board using the same. <P>SOLUTION: The adhesive film is an adhesive film for carrying out flip chip packaging of a semiconductor chip 200 which has a bump on a wiring board, wherein the lowest viscosity by a capillary rheometer method at a heating adhesion temperature is less than 100 Pa s. Moreover, in a wiring board 100, the adhesive film in which the lowest viscosity by a capillary rheometer method at a preheating temperature is less than 100 Pa s in which the semiconductor chip is heated in a status being arranged to a prescribed position in advance of flip chip connection is laminated to a surface on which a bump 130 which carries out flip chip connection to an external connection terminal of the semiconductor chip is formed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
