HIGH EFFICIENCY ELECTROSTATIC CHUCK ASSEMBLY FOR SEMICONDUCTOR WAFER PROCESSING
摘要
<p>The present invention generally provides a high efficiency electrostatic chuck including a flex stack having an electrode disposed between two layers of dielectric material. At least one of the layers is a standard or high purity thermoplastic film. The flex stack may have a matte finish on the substrate supporting surface to provide benefits such as improved temperature distribution across the surface of the chuck. The non-substrate supporting or pedestal receiving side of the flex stack may be plasma treated to provide a desired surface finish, which is then bonded to a pedestal using an acrylic or epoxy adhesive resulting in superior bonding strength compared to traditional polymer electrostatic chucks. The electrode may be a sheet electrode on a release liner, which enables ease of manufacturing.</p>
申请公布号
WO2012082188(A1)
申请公布日期
2012.06.21
申请号
WO2011US48647
申请日期
2011.08.22
申请人
APPLIED MATERIALS, INC.;BHATNAGAR, ASHISH;AGARWAL, MONIKA;GOPALAKRISHNAN, PADMA;MARTIN, DANIEL
发明人
BHATNAGAR, ASHISH;AGARWAL, MONIKA;GOPALAKRISHNAN, PADMA;MARTIN, DANIEL