ADHESIVE FILM FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE: An adhesive film for semiconductors is provided to minimize peeling force between a protection film and a dibond film, thereby maintaining shape of the dibond film after exfoliating the protection film. CONSTITUTION: An adhesive film for semiconductors comprises a dicing(2), a dibonding adhesive(1), and a protection film(3). The dicing, dibonding adhesive, and protection film are successively laminated. The dibonding adhesive has one or more of shape from the following: a circular shape which has one or more of triangular shape with sharp end, a circular shape which has one or more of triangular shape with rounded end in outer circumference, and an oval shape. An exfoliation force between the protection film and an end point of the dibonding adhesive is 1/10 or less of exfoliation force between the dicing and the dibonding adhesive.