发明名称 CURABLE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a curable resin composition of moisture-curable type which contains no organic tin compound, and has moisture-curability equal to or higher than that of a composition obtained using an organic tin compound, and good storage stability. <P>SOLUTION: The curable resin composition contains components (A) to (C): the component (A) is a compound having at least two hydrolyzable silyl groups in a molecule, the component (B) is pentafluorobenzaldehyde and/or pentafluorothiophenol, and the component (C) is an amine compound other than the component (A). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012116998(A) 申请公布日期 2012.06.21
申请号 JP20100269903 申请日期 2010.12.03
申请人 THREE BOND CO LTD 发明人 HARA OSAMU
分类号 C08G77/08;C08K5/07;C08K5/17;C08L33/00;C08L71/02 主分类号 C08G77/08
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