| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board in which a semiconductor device can be normally mounted thereon without causing a short circuit and an electrical insulation failure between adjacent semiconductor device connection pads, even when the semiconductor device having electrode terminals arranged in high density is mounted thereon. <P>SOLUTION: A wiring board 10 is configured that a plurality of semiconductor device connection pads 8 connecting to an upper surface through the electrode terminals T and a solder 7, are arranged so as to correspond the arrangement of the electrode terminals T in order to mount a semiconductor device S in which a plurality of electrode terminals T are arranged along an outer periphery of a lower surface. In the wiring board, the semiconductor device connection pads 8 have shapes that widths of adjacent pads spread alternately toward the opposite direction, and a pool of solder 7 is formed in the wide-width part. <P>COPYRIGHT: (C)2012,JPO&INPIT |
