发明名称 FLEXIBLE PRINTED WIRING BOARD, ELECTRONIC CIRCUIT MODULE, AND ELECTRONIC APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a flexible printed wiring board subjected to folding in which opening (peeling of a folded portion) of the flexible printed wiring board can be prevented by relaxing spring-back of the flexible printed wiring board effectively, and to provide an electronic circuit module where an electronic apparatus is mounted on the flexible printed wiring board, and an electronic apparatus including the electronic circuit module. <P>SOLUTION: A flexible printed wiring board 10 comprises a substrate 11, a conductive layer 12 including circuit wiring 12a laminated on the substrate 11, and an insulation layer 13 laminated on the conductive layer 12. The flexible printed wiring board 10 is provided with a folding portion 14 which is folded from one surface to the other surface in order to be affixed to the other surface in surface contact state. The folding portion 14 is provided with at least two folding wires 14a intersecting the folding direction perpendicularly. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012119497(A) 申请公布日期 2012.06.21
申请号 JP20100268010 申请日期 2010.12.01
申请人 SUMITOMO ELECTRIC PRINTED CIRCUIT INC 发明人 KAWAKAMI SHIGEKI;KAZAHARA MASAHIKO;NISHIYAMA HAJIME
分类号 H05K1/02 主分类号 H05K1/02
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