| 摘要 |
<P>PROBLEM TO BE SOLVED: To make it possible to, on the occasion of manufacturing a resin-sealed type semiconductor device (1), carry out joining work between members at a relatively low temperature. <P>SOLUTION: On the occasion of joining a heat sink (2) and a lead frame (3) together, first, an application step is carried out to apply a resin solution (L), which is obtained by dissolving a polyimide-based resin in a solvent, to a joining portion of an upper surface of the heat sink (2). Next, a first drying step is carried out to dry the applied resin solution (L) until it reaches a semi-dried state (where the amount of a residual solvent is within a range of 13% to 40%). Then, a thermocompression joining step is carried out to join a joining target portion (3a) of the lead frame (3) to the heat sink (2) through the resin solution (L) under the semi-dried state. Following this, a second drying step is carried out to further dry the resin solution (L). <P>COPYRIGHT: (C)2012,JPO&INPIT |
