| 摘要 |
PURPOSE: A manufacturing method of a printed circuit board is provided to simultaneously laminate an insulating layer in which a copper foil is formed on both surfaces of an inner layer circuit board, thereby preventing a bending problem generated during a printed circuit board manufacturing process. CONSTITUTION: A first circuit layer and a second circuit layer are formed on both surfaces of an inner layer circuit board(100). The inner layer circuit board includes a first via for connecting the first circuit layer and the second circuit layer. A copper foil is formed on one side of a second insulating layer(200). A third circuit layer(300) includes a second via(310) which is respectively connected to the first circuit layer and the second circuit layer. A protective layer is formed on the third circuit layer. The protective layer is a solder resist layer which is comprised of a heat-resistant resin. |
