| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cooling device of an LED light source using a Peltier element in a heat dissipation path of a light-emitting module including LED elements in which the Peltier element does not become the bottle neck of heat dissipation when the LED elements are arranged to concentrate. <P>SOLUTION: The cooling device of an LED light source comprises a thermal diffusion section (3) having endothermic adhesion surfaces (12, 13) adhering to the endothermic surfaces (8, 10) of Peltier elements (4, 7), and a heat radiation section (5) having heat radiation adhesion surfaces (14, 15) forming a plane that faces the endothermic adhesion surfaces (12, 13) of the thermal diffusion section and adhering to the heat radiation surfaces (9, 11) of the Peltier elements, and a heat radiation mechanism (16) which radiates heat to the outside. The thermal diffusion section (3) and the heat radiation section (5) have a plurality of endothermic adhesion surfaces (12, 13) and heat radiation adhesion surfaces (14, 15) on which a plurality of Peltier elements can be arranged with different planes. <P>COPYRIGHT: (C)2012,JPO&INPIT |
