| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component capable of preventing the electronic component from being mounted incorrectly while suppressing an increase in a product dimension. <P>SOLUTION: A manufacturing method of an electronic component 1 comprises: a flat plate preparation step S2 of preparing a flat plate 20 having an uneven shape on its surface; a paste imparting step S3 of imparting a first conductive paste P1 so as to enter a recess 21 of a surface of the flat plate 20; a first paste layer formation step S5 of forming a first paste layer 16 by imparting a conductive paste P by pressing the end surface 2a, 2b sides of a body 2 against the first conductive paste P1 imparted to the recess 21; and a second paste layer formation step S7 of forming a second paste layer 17 by imparting a second conductive paste P2 to the end surface 2a, 2b sides of principal surfaces 2c, 2d of the body 2 via screen printing. <P>COPYRIGHT: (C)2012,JPO&INPIT |
