| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip component mounting wiring board which has a new joining structure of a chip component which does not use soldering and is produced at low cost, and to provide a manufacturing method of the chip component mounting wiring board. <P>SOLUTION: In chip component mounting wiring boards, wiring circuits 61, 62 are respectively formed on surfaces of resin substrates 10, a chip component 30 is mounted on each resin substrate 10 and connected with an end part of each wiring circuit 61, 62. In the chip component mounting wiring boards 101, 102, the wiring circuits 61, 62 respectively have a two-layer structure formed by metal foil 61a, 62a serving as lower layers and metal plating layers 61b, 62b serving as upper layers, the chip component 30 is crimped and joined to the metal plating layers 61b, 62b. <P>COPYRIGHT: (C)2012,JPO&INPIT |
