| 发明名称 |
WAFER SUBSTRATE BONDING STRUCTURE AND LIGHT EMITTING DEVICE COMPRISING THE SAME |
| 摘要 |
A wafer substrate bonding structure may be provided that includes: a first substrate; and a conductive thin film which is disposed on the first substrate and includes a resin and conductive corpuscles included in the resin. |
| 申请公布号 |
US2012153329(A1) |
申请公布日期 |
2012.06.21 |
| 申请号 |
US201113311856 |
申请日期 |
2011.12.06 |
| 申请人 |
CHO BUM CHUL |
发明人 |
CHO BUM CHUL |
| 分类号 |
H01L33/60;H01L23/532;H01L33/36 |
主分类号 |
H01L33/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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