发明名称 ELECTRONIC COMPONENT ALIGNING DEVICE, ELECTRONIC COMPONENT PACKAGING BODY, AND ELECTRONIC COMPONENT MOUNTING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component aligning device, an electronic component packaging body, and an electronic component mounting board. <P>SOLUTION: The electronic component aligning device may include: a tray provided with electronic components formed by stacking dielectric sheets on which inner conductors are formed; a transfer unit continuously transferring the electronic components moved from the tray; and a magnetic field providing unit providing a magnetic field to the electronic components moved from the transfer unit to align the inner conductors in a direction in which magnetic resistance due to the magnetic field decreases. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012119660(A) 申请公布日期 2012.06.21
申请号 JP20110182231 申请日期 2011.08.24
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 CHOE PUM-SAN;KIM DOO YOUNG;KANG HEON HUR;CHO HON-YON
分类号 H05K13/02 主分类号 H05K13/02
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