发明名称 |
ELECTRONIC COMPONENT ALIGNING DEVICE, ELECTRONIC COMPONENT PACKAGING BODY, AND ELECTRONIC COMPONENT MOUNTING BOARD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component aligning device, an electronic component packaging body, and an electronic component mounting board. <P>SOLUTION: The electronic component aligning device may include: a tray provided with electronic components formed by stacking dielectric sheets on which inner conductors are formed; a transfer unit continuously transferring the electronic components moved from the tray; and a magnetic field providing unit providing a magnetic field to the electronic components moved from the transfer unit to align the inner conductors in a direction in which magnetic resistance due to the magnetic field decreases. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012119660(A) |
申请公布日期 |
2012.06.21 |
申请号 |
JP20110182231 |
申请日期 |
2011.08.24 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
CHOE PUM-SAN;KIM DOO YOUNG;KANG HEON HUR;CHO HON-YON |
分类号 |
H05K13/02 |
主分类号 |
H05K13/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|