发明名称 MICROPUMP AND COOLING SYSTEM
摘要 <P>PROBLEM TO BE SOLVED: To reduce power consumption in a micropump and a cooling system. <P>SOLUTION: This micropump includes: a pump chamber 20; an elastically deformable diaphragm 12 having one main surface 12x to demarcate an internal surface of the pump chamber 20; and a thermal deformation member 17 pressing the other main surface 12y of the diaphragm 12 during a low temperature and separating from the diaphragm 12 during a high temperature. When heated fluid C is made to flow in the pump chamber 20, the thermal deformation member 17 pressing the diaphragm 12 is deformed by heat of the fluid C and separates from the diaphragm 12 to increase volume of the pump chamber 20. When the thermal deformation member 17 separated from the diaphragm 12 is cooled more than the temperature of the fluid C, the thermal deformation member 17 is deformed to press the other main surface 12y of the diaphragm 12 and to reduce the volume of the pump chamber 20. In the micropump, inflow and outflow of the fluid C into/from the pump chamber 20 are repeated by repeating the increase and reduction of the volume of the pump chamber 20. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012117416(A) 申请公布日期 2012.06.21
申请号 JP20100266512 申请日期 2010.11.30
申请人 FUJITSU LTD 发明人 TOYODA OSAMU
分类号 F04B43/02 主分类号 F04B43/02
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