发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
A semiconductor device includes a semiconductor element; a pad electrode that is formed on the semiconductor element; an alignment mark that is formed on the semiconductor element; a connection electrode that is formed on the pad electrode; and an underfill resin that is formed to cover the connection electrode. The height of the alignment mark from the semiconductor element is greater than that of the connection electrode.
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申请公布号 |
US2012153462(A1) |
申请公布日期 |
2012.06.21 |
申请号 |
US201113312565 |
申请日期 |
2011.12.06 |
申请人 |
WAKIYAMA SATORU;SONY CORPORATION |
发明人 |
WAKIYAMA SATORU |
分类号 |
H01L23/498;H01L21/50;H01L21/56;H01L23/52 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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