发明名称 |
Use of Low-Temperature Foamable Epoxide Resins in Hollow Chamber Structures |
摘要 |
A method for reinforcing a substrate having a hollow structure or for fixing an insert in such a substrate comprises introducing a one- or two-component expandable and curable preparation based on epoxy resin into a selected part of the hollow structure to be reinforced. The preparation cures by being heated to a temperature in the range from 20 to 100° C. or above, while being expanded. An epoxy resin prepolymer and an organic ammonium carbamate, which at a temperature in the range from 20° to 100° C. or above releases at least 25% of the CO2 bound as carbamate. |
申请公布号 |
US2012156412(A1) |
申请公布日期 |
2012.06.21 |
申请号 |
US201213407837 |
申请日期 |
2012.02.29 |
申请人 |
BANKMANN DENNIS;BARRIAU EMILIE;RENKEL MARTIN;WUCHERPFENNIG SVEN;LAMMERSCHOP OLAF;BRAUN KARL;HENKEL AG & CO. KGAA |
发明人 |
BANKMANN DENNIS;BARRIAU EMILIE;RENKEL MARTIN;WUCHERPFENNIG SVEN;LAMMERSCHOP OLAF;BRAUN KARL |
分类号 |
B32B1/08;B05D7/22;B29C65/02 |
主分类号 |
B32B1/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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