Method for performing two-sided planarization of semiconductor material e.g. wafer, involves providing the insert inside recesses in rotary disc, while supplying the polishing agent in the recess

摘要

The method involves forming several recesses (3) in a semiconductor made grinding disc (1). An insert (2) is provided inside the recesses in rotary disc, while supplying the polishing agent in the recess. The insert is provided with several cylindrical or spherical individual elements (2a) that are lined up at the edges of the insert.