METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

摘要

Disclosed herein is a method of manufacturing a printed circuit board that simultaneously forms a via and an embedding land and thus improves the matching value of the via and the embedding land to secure interlayer conduction reliability, and further simultaneously forms the via and the embedding land to reduce manufacturing costs. In addition, the embedding land is formed to be embedded in the second insulating layer to implement high-density/high-integration of the printed circuit board and a via is formed in less time as compared to a method of forming a via hole using laser to reduce a process time.