发明名称 PACKAGE STRUCTURE
摘要 The invention discloses a package structure including a semiconductor device, a first protection layer, a second protection layer and at least one conductive bump. The semiconductor device has at least one pad. The first protection layer is disposed on the semiconductor device and exposes the pad. The second protection layer, disposed on the first protection layer, has at least one first opening and at least one second opening. The first opening exposes a partial surface of the pad. The second opening exposes a partial surface of the first protection layer. The conductive bump, opposite to the pad, is disposed on the second protection layer and coupled to the pad through the first openings.
申请公布号 US2012153465(A1) 申请公布日期 2012.06.21
申请号 US200913393459 申请日期 2009.09.01
申请人 发明人 CHEW JIMMY HWEE-SENG;ONG KIAN CHEE;LAU KWANG KEE
分类号 H01L23/48 主分类号 H01L23/48
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