| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED package which can be easily downsized. <P>SOLUTION: An LED package 1 comprises: first to third lead frames; upper surface terminal type LED chips 21B and 21G which are mounted on the first lead frame 12, connected to the second lead frame at one side terminals, and connected to the third lead frame at the other side terminals; upper surface terminal type protection chips 22A and 22B which are mounted on the first lead frame, connected to the second lead frame at one side terminals, and connected to the third lead frame at the other side terminals; and a resinous body. The external shape of the resinous body forms the outer shape of the LED package. <P>COPYRIGHT: (C)2012,JPO&INPIT |
