发明名称 METAL LAMINATE, BOARD FOR MOUNTING LED, AND LIGHT SOURCE DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a metal foil laminate suitable for printed wiring boards for mounting LEDs which has high heat resistance, high reflectance in the visible light region, and which allows to increase the area and to prevent the reflectance from decreasing in a high temperature heat load environment. <P>SOLUTION: The metal laminate includes: a resin layer (A) containing thermoplastic resin and a resin layer (B) containing polyorganosiloxane and inorganic filler. The resin layer (A) and/or the resin layer (B) are formed by laminating metal layers. The average reflectance in the 400-800 nm wavelength range is 80% or greater on exposed surfaces when the metal layers are released and the resin layer (A) and/or the resin layer (B) are exposed. The reduction ratio of the reflectance at a 470 nm wavelength is 5% or less after heat treatment at 260&deg;C for 10 min. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012116003(A) 申请公布日期 2012.06.21
申请号 JP20100265205 申请日期 2010.11.29
申请人 MITSUBISHI PLASTICS INC 发明人 MATSUI JUN;SUZUKI HIDEJI
分类号 B32B15/08;B32B27/00;C08J5/18;H01L33/48 主分类号 B32B15/08
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