| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which can always ensure exact mounting of a semiconductor element, or transmission/reception of optical or electric signals between the semiconductor element and an optical fiber, a connector, or the like, connected therewith, and to provide a method of manufacturing the same. <P>SOLUTION: A wiring board 10 comprises a connection pad 2 formed on the upper surface of an insulation substrate 1 and used for external connection, and a solder resist layer 3 applied to the upper surface of the insulation substrate 1 and having an opening 4 which exposes the connection pad 2. The solder resist layer 3 covers at least a part of the outer peripheral side surface of the insulation substrate 1, and the surface at a part covering the outer peripheral side surface is a flat surface formed simultaneously with the opening 4 by photolithography technique. <P>COPYRIGHT: (C)2012,JPO&INPIT |
