发明名称 |
TRANSPARENT LED CHIP PACKAGE AND LED LIGHTING INCLUDING SAME |
摘要 |
The present invention relates to a LED chip package, which is made from a transparent material and comprises a first concave portion at the center of the upper surface in which the LED chip is seated. According to the above configuration, the present invention can provide a LED light bulb which provides a wide light source in an LED that can irradiate in 360 degrees and can effectively dissipate heat that is generated from the LED to the outside. |
申请公布号 |
WO2012081875(A1) |
申请公布日期 |
2012.06.21 |
申请号 |
WO2011KR09547 |
申请日期 |
2011.12.12 |
申请人 |
SONIX JAPAN INC.;KIM, YOUNG CHUL |
发明人 |
KIM, YOUNG CHUL |
分类号 |
F21S2/00;F21Y101/02;H01L33/48 |
主分类号 |
F21S2/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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