发明名称 TRANSPARENT LED CHIP PACKAGE AND LED LIGHTING INCLUDING SAME
摘要 The present invention relates to a LED chip package, which is made from a transparent material and comprises a first concave portion at the center of the upper surface in which the LED chip is seated. According to the above configuration, the present invention can provide a LED light bulb which provides a wide light source in an LED that can irradiate in 360 degrees and can effectively dissipate heat that is generated from the LED to the outside.
申请公布号 WO2012081875(A1) 申请公布日期 2012.06.21
申请号 WO2011KR09547 申请日期 2011.12.12
申请人 SONIX JAPAN INC.;KIM, YOUNG CHUL 发明人 KIM, YOUNG CHUL
分类号 F21S2/00;F21Y101/02;H01L33/48 主分类号 F21S2/00
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