发明名称 POLYIMIDE FILM LAMINATE AND METAL LAMINATE EMPLOYING THE SAME
摘要 The disclosure provides a polyimide film laminate and a metal clad laminate employing the same. The polyimide film laminate includes a first polyimide film, a second polyimide film disposed on the first polyimide film, and a third polyimide film disposed on the second polyimide film. Particularly, the first polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV, the second polyimide film has a thermal conductivity of more than about 1 watts/m·K, and the third polyimide film has a thermal conductivity of between about 0.2-0.9 watts/m·K and a breakdown voltage greater than about 3KV.
申请公布号 US2012156459(A1) 申请公布日期 2012.06.21
申请号 US201113158703 申请日期 2011.06.13
申请人 LU CHARNG-SHING;CHIN SI-YI;LIU SHUR-FEN;KING JINN-SHING 发明人 LU CHARNG-SHING;CHIN SI-YI;LIU SHUR-FEN;KING JINN-SHING
分类号 B32B15/088;B32B7/02;B32B15/00;B32B27/20 主分类号 B32B15/088
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