发明名称 CONTINUOUS METAL SEMICONDUCTOR ALLOY VIA FOR INTERCONNECTS
摘要 Methods of forming a semiconductor structure including a semiconductor nanowire or epitaxial semiconductor material which extends from at least a surface of source region and the drain region are provided. The methods include converting an upper portion of the source region and the drain region and the semiconductor nanowire or epitaxial semiconductor material into a continuous metal semiconductor alloy. The continuous metal semiconductor alloy includes a lower portion that is contained within an upper surface of each of the source region and the drain region, and a vertical pillar portion extending upwardly from the lower portion.
申请公布号 US2012156857(A1) 申请公布日期 2012.06.21
申请号 US201213405598 申请日期 2012.02.27
申请人 COHEN GUY;DIMITRAKOPOULOS CHRISTOS D.;GRILL ALFRED;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 COHEN GUY;DIMITRAKOPOULOS CHRISTOS D.;GRILL ALFRED
分类号 H01L21/28;H01L21/30 主分类号 H01L21/28
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