发明名称 Circuit assembly with at least two sub-modules
摘要 <p>The arrangement has contact lug (16) which is provided with a contact (18) for contacting with contact element of printed circuit board. A sub-module (10) is provided with associated substrate (12) which encloses a frame (24). The frame is attached to auxiliary carrier (28) on which contact lug is fixed. The auxiliary carrier is provided with a positioning element (36) which is provided for performing positional alignment and centering contact of corresponding contact lug with respect to contact element of sub-modules, when printed circuit board is attached to circuit arrangement structure.</p>
申请公布号 EP2467001(A1) 申请公布日期 2012.06.20
申请号 EP20110188754 申请日期 2011.11.11
申请人 SEMIKRON ELEKTRONIK GMBH & CO. KG 发明人 BECKEDAHL, PETER;BOGEN, INGO;EHLER, RALF;KNEBEL, MARKUS
分类号 H05K1/14 主分类号 H05K1/14
代理机构 代理人
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