| 发明名称 |
Method of electroplating uniform copper layer on the edge and walls of though holes of a substrate. |
| 摘要 |
Electroplating methods provide substantially uniform deposits of copper on the edges and walls of through-holes of printed circuit boards. The electroplating methods provide copper deposits which have high throwing power. |
| 申请公布号 |
EP2465976(A1) |
申请公布日期 |
2012.06.20 |
| 申请号 |
EP20110193194 |
申请日期 |
2011.12.13 |
| 申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
NAJJAR, ELIE H.;LEFEBVRE, MARK;BARSTAD, LEON R.;TOBEN, MICHAEL P. |
| 分类号 |
C25D3/38;C25D7/12;H01L21/768 |
主分类号 |
C25D3/38 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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