| 摘要 |
<p>The invention provides a method for fabricating a silicon wafer solar cell, comprising the following steps: texturing a silicon wafer, forming a p-n junction, performing a wet chemical surface treatment, performing a passivation layer formation process, and performing electrodes formation process, wherein the wet chemical surface treatment comprises the following specific process flow: performing a backside phosphosilicate glass (PSG) removal process, performing an edge isolation and backside polish process, performing a double-side phosphosilicate glass and oxide removal process, and performing a front-side shallow junction formation process.</p> |
