| 摘要 |
The present invention relates a heat dissipation module applied to a microprocessor or light-emitting diodes. The heat dissipation module is provided with at least one heat-conducting column, on at least one end of which an outwardly extending expanded element is provided and on the periphery of which a heat-dissipating element is provided. Insuchmanner, when the heat dissipation module is used for heat dissipation of a microprocessor, the area in contact with a heat source is enlarged by the expanded element, with rapid heat dissipation through the heat -conducting column and the heat-dissipating element. Moreover, when the heat dissipation module is used for light-emitting diodes, the expanded element can increase the heat dissipation area and the number of light-emitting diodes positioned to accelerate heat dissipation. |
