发明名称 GOLD ALLOY WIRE FOR USE AS BONDING WIRE EXHIBITING HIGH INITIAL BONDING CAPABILITY, HIGH BONDING RELIABILITY, HIGH CIRCULARITY OF PRESS BONDED BALL, HIGH STRAIGHT ADVANCING PROPERTY AND HIGH RESIN FLOW RESISTANCE
摘要 There is provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, and high resin flowability resistance. The gold alloy wire for a bonding wire comprises one kind or two kinds of Pt and Pd of 1000 to less than 5000 ppm in total, Ir: 1 to 200 ppm, Ca: 20 to 100 ppm, Eu: 10 to 100 ppm, Be: 0.1 to 20 ppm, if necessary, and La: 10 to 100 ppm, if necessary. The total amount of at least two kinds of Ca, Eu, Be, and La is in a range of 50 to 250 ppm.
申请公布号 EP1901344(A4) 申请公布日期 2012.06.20
申请号 EP20060766497 申请日期 2006.06.08
申请人 TANAKA DENSHI KOGYO KABUSHIKI KAISHA 发明人 MAKI, KAZUNARI;NAKATA, YUJI
分类号 H01L23/49;B23K35/30;C22C5/02;H01B1/02;H01L21/60 主分类号 H01L23/49
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