发明名称 |
High efficiency electrostatic chuck assembly for semiconductor wafer processing |
摘要 |
The present invention generally provides a high efficiency electrostatic chuck including a flex stack having an electrode disposed between two layers of dielectric material. At least one of the layers is a standard or high purity thermoplastic film. The flex stack may have a matte finish on the substrate supporting surface to provide benefits such as improved temperature distribution across the surface of the chuck. The non-substrate supporting or pedestal receiving side of the flex stack may be plasma treated to provide a desired surface finish, which is then bonded to a pedestal using an acrylic or epoxy adhesive resulting in superior bonding strength compared to traditional polymer electrostatic chucks. The electrode may be a sheet electrode on a release liner, which enables ease of manufacturing. |
申请公布号 |
EP2466633(A1) |
申请公布日期 |
2012.06.20 |
申请号 |
EP20110178926 |
申请日期 |
2011.08.25 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
BHATNAGAR, ASHISH;AGARWAL, MONIKA;GOPALAKRISHNAN, PADMA;MARTIN, DANIEL |
分类号 |
H01L21/683;C23C14/50;C23C16/458;H01L21/67;H02N13/00 |
主分类号 |
H01L21/683 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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