发明名称 INJECTION MOLDING APPARATUS FOR THERMOSETTING RESIN
摘要 PURPOSE: An injection molding device for thermosetting resin is provided to reduce energy consumption by instantaneously heating stampers to a required temperature using induction heating units. CONSTITUTION: An injection molding device for thermosetting resin comprises induction heating units(130) and stampers(140). The induction heating units are installed on lower and upper dies(110,120) and heat the stampers. The stampers are installed on the lower and upper dies, and the surfaces of the stampers are exposed to a cavity. The stampers cure thermosetting resin injection-molded from the cavity and print patterns on the surface of the molded thermosetting resin.
申请公布号 KR20120064740(A) 申请公布日期 2012.06.20
申请号 KR20100125901 申请日期 2010.12.10
申请人 KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY 发明人 KANG, JEONG JIN;HONG, SEOK KWAN
分类号 B29C45/73;B29C33/42;B29C35/12 主分类号 B29C45/73
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