METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, RECORDING MEDIUM HAVING MANUFACTURING PROGRAM STORED THEREON AND MANUFACTURING APPARATUS

摘要

PURPOSE: A method and apparatus for manufacturing a semiconductor device and a recording medium storing a manufacturing program are provided to improve the bonding strength of a semiconductor chip by interposing an adhesive layer between the semiconductor chips. CONSTITUTION: A bonding layer(10) is formed on the first surface(1b) of a plurality of semiconductor chips(9). A semiconductor chip is laminated with a step by interposing the bonding layer between the semiconductor chips. A first region(P1) is not contacted with the upper side of another semiconductor chip. A second region(P2) is contacted with the upper side of another semiconductor chip. A convex part(10a) is located in the first region.