发明名称 |
METHOD OF MANUFACTURING SOLID STATE IMAGING DEVICE |
摘要 |
A mask (68) is attached to a circuit assembly board (47) on which a plurality of sensor packages (4) are adhered. An upper face of a cover glass (6) of each sensor package (4) is protected by a mask section (68b) of the mask (68). The circuit assembly board (47) is set in a vacuum screen printing machine and paste of sealing resin (7) is supplied to it. The circuit assembly board (47) is moved in a horizontal direction on a stage with a squeegee (65) pressed onto an upper face of the mask (68). The squeegee (65) presses to fill the sealing resin (7) around each of the sensor packages (4). |
申请公布号 |
EP1861880(B1) |
申请公布日期 |
2012.06.20 |
申请号 |
EP20060730735 |
申请日期 |
2006.03.24 |
申请人 |
FUJIFILM CORPORATION |
发明人 |
NISHIDA, KAZUHIRO;SHIMAMURA, HITOSHI;TAKASAKI, KOSUKE |
分类号 |
H01L27/14;H01L23/10 |
主分类号 |
H01L27/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|